Work

Temperature-Dependent Material Characterization of Back-End-of-Line Copper with Nanoindentation for FEM-Based Wafer Warpage Prediction

Year: 2025

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/eurosime65125.2025.11006541

Authors: Prashant Kumar Singh, Holm Geisler, Kashi Vishwanath Machani, Dirk Breuer, Karsten Meier, Frank Kuechenmeister, Karlheinz Bock

Institutions: GlobalFoundries (Germany), Technische Universität Dresden

Language: English

Topic: Metal and Thin Film Mechanics

Subfield: Mechanics of Materials

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410639349

FWCI: 5.74

Cites: 31

Cited by: 1

Related to: 10