Work

Simulation-Driven Insights Into Nanoindentationbased Adhesion Strength Measurement of Wafer-to-Wafer Bonds

Year: 2025

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/eurosime65125.2025.11006560

Authors: Yusuf Burak Ozdemir, Oguzhan Orkut Okudur, Kris Vanstreels, Mario Gonzalez, Clement Merckling

Institutions: IMEC, KU Leuven

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410639635

FWCI: 4.717

Cites: 17

Cited by: 2

Related to: 10