Work

Sensitivity Analysis of Simulation-Based Lifetime Extrapolation in the Low Temperature Swing Regime for Power Modules Stressed in Power Cycling Tests

Year: 2025

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/eurosime65125.2025.11006634

Authors: Nils Zöllner, Sebastian Letz, David Übelacker, Oliver Schilling

Institution: Infineon Technologies (Germany)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Affordable and clean energy

Open Access status: closed

OpenAlex ID: W4410639684

FWCI:

Cites: 11

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Related to: 10