Low-Resistance Cu–Cu Bonding With the Formic Acid-Treated Co Passivation Layer
Year: 2025
Type: article
Authors: Yun-Hao Shao, Gui Chen, Xinwei Wu, Haijiao Xie, Xin-Ping Qu
Institutions: Fudan University, State Key Laboratory of ASIC and System
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4410639705