Work

Reflow Process Effect on Single Microvias of Different Layers in the Printed Circuit Board

Year: 2025

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/eurosime65125.2025.11006597

Authors: Vikram G Kamble, Markus Weninger, Thomas Antretter, Julia Zuendel, Thomas Krivec, Peter Filipp Fuchs

Institutions: AT&S (Austria), Montanuniversität Leoben, Polymer Competence Center Leoben (Austria)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4410639740

FWCI: 2.3

Cites: 29

Cited by: 1

Related to: 10