Work

A Methodology for Identifying Capillary Underfill Optimized Material Properties

Year: 2025

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/eurosime65125.2025.11006593

Authors: Dariush Ghaffari Tari, Christian Nordhorn

Institutions: Henkel (United States), Henkel (Germany)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4410639748

FWCI:

Cites: 8

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Related to: 10