Work

Usage of Reactive Joining Methods on LTCC Substrates: Experiments and Simulation

Year: 2025

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/eurosime65125.2025.11006566

Authors: Erik Wiss, Nesrine Jaziri, Jens Müller, Steffen Wiese

Institutions: Saarland University, Technische Universität Ilmenau

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410639832

FWCI:

Cites: 24

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Related to: 10