Work

Design Optimization Study by AI-Surrogate PBGA Reliability Model and Transfer Learning

Year: 2025

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/eurosime65125.2025.11006571

Authors: Cadmus Yuan, Jian-Cheng Hong, Si-Han Lin, Pin-Sian Li

Institution: Feng Chia University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4410639833

FWCI:

Cites: 7

Cited by:

Related to: 10