Work

Analyses of Materials Behavior and Solder Fatigue Test and Prediction Results for Long-Term Thermal Cycling

Year: 2025

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/eurosime65125.2025.11006535

Authors: Rainer Dudek, Kerstin Kreyßig, Matthias Prinz, Susana Richter-Trummer, Jan Albrecht, Sven Rzepka, Peter Fruehauf, Andreas Weigert

Institutions: Fraunhofer Institute for Electronic Nano Systems, Siemens (Germany)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410639837

FWCI:

Cites: 10

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Related to: 10