Work

Damage Life-Prediction Model for Doped Lead-Free SnAgCu Solder Electronic Assemblies Under High Strain Rate Vibration After Prolonged Storage

Year: 2025

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/eurosime65125.2025.11006627

Authors: Vsiahl Mehta, Pradeep Lall

Institution: Auburn University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funder: Auburn University

OpenAlex ID: W4410639846

FWCI:

Cites: 32

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Related to: 10