Work

Mechanical Strength Assessment of Ruthenium Nano-Interconnects with Airgaps Using Wedge Indentation

Year: 2025

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/eurosime65125.2025.11006551

Authors: Yao Yao, Kris Vanstreels, Abdellah Salahouelhadj, Oguzhan Orkut Okudur, Mario Gonzalez

Institution: IMEC

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4410639849

FWCI:

Cites: 10

Cited by:

Related to: 10