Work

Metal Thin Film Deposition Technique for Next-Generation Microelectronics

Year: 2025
Type: article
Abstract: A supercritical carbon dioxide fluid is a compressive high-pressure medium which has a solvent capability, low diffusivity, zero surface tension, and non-toxicity. It enables to deliver chemical reagent for metal thin film deposition deep into complex features so that a conformal film deposition and filling metal into high-aspect holes. The uniqueness of the supercritical carbon dioxide is a key to realize an environmentally-friendly deposition process for future electronic devices.
Language: English
Open Access status: diamond
OpenAlex ID: W4410712604
FWCI: 0.163
Cites: 29
Cited by: 1
Related to: 10