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Balancing AI Engagement: How AI Experience and Satisfaction Reduce Technostress among Indonesian Employees

Year: 2025

Type: conference-paper

Study design: Observational Study

Source: International Conference on Innovative Research in Applied Science, Engineering and Technology (IRASET)

DOI: 10.1109/iraset64571.2025.11008039

Authors: Marvine Aldrich Emmanuel, Ryan Sandi, Maria Grace Herlina

Institution: Binus University

Language: English

Topic: Technostress in Professional Settings

Subfield: Social Psychology

Field: Psychology

Domain: Social Sciences

SDGs: Decent work and economic growth, Good health and well-being

Open Access status: closed

OpenAlex ID: W4410738794

FWCI: 6.184

Cites: 50

Cited by: 3

Related to: 10