Failure analysis of acceleration sensor with potting adhesive for EMU
Year: 2025
Type: conference-paper
DOI: 10.1117/12.3065567
Authors: Xuguang Lin, Wenjun Wang, Bo Zhou, Dequan Liu, Donghui Yuan, Abo Dou
Language: English
Subfield: Mechanical Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4410766350
