Work

A hybrid Cu-Al BEOL process for cost effective and efficient tool utilization

Year: 2025

Type: conference-paper

Source: Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

DOI: 10.1109/asmc64512.2025.11010514

Authors: Praveen Kumar Arikath, Lee Mien Sze, Peck Yan Zheng, Xie Jun, Daiyu Huang, Tubati Sricharan, Islam Mohd Nurul, Shao Jian Xin, Chong Chia Yee

Institution: GlobalFoundries (Singapore)

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410770288

FWCI:

Cites: 5

Cited by:

Related to: 10