Work

Correlation Between In-Situ Wafer-Level Temperature Distribution During the Etch Process and Via Resistivity

Year: 2025

Type: conference-paper

Source: Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

DOI: 10.1109/asmc64512.2025.11010324

Authors: Marion Brisson, Quentin Renot, Emeric Mathivet, Matteo Rossi

Institutions: STMicroelectronics (France), KLA (United States)

Language: English

Topic: Plasma Diagnostics and Applications

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410770361

FWCI:

Cites: 7

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Related to: 10