Work

Enabling 3D Integration: Full pattern wafer die shape characterization using Wave Front Phase Imaging at 8μm lateral resolution

Year: 2025

Type: conference-paper

Source: Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

DOI: 10.1109/asmc64512.2025.11010472

Authors: Miguel Jimenez Gomis, Kiril Ivanov-Kurte, Juan M. Trujillo-Sevilla, Sebastien Pauliac-Vaujour, Jose M. Rodriguez-Ramos

Institution: Universidad de La Laguna

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410770787

FWCI:

Cites: 5

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Related to: 10