Work

Characterization of Electromigration-Induced Degradation in Microbumps via On-Chip Embedded Temperature Sensors Under High Current Density

Year: 2025

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2025.3574203

Authors: Zhenwen Pu, Yuexing Wang, Linwei Cao, Jichao Qiao, Xiangyu Sun

Institutions: Northwestern Polytechnical University, China Academy of Engineering Physics

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Natural Science Foundation of China

Award: G801920185

OpenAlex ID: W4410770826

FWCI: 0.231

Cites: 35

Cited by: 1

Related to: 10