Work

Elimination of 3D NAND Through-Array Contact Shortage on Yield Enhancement

Year: 2025

Type: conference-paper

Source: Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

DOI: 10.1109/asmc64512.2025.11010495

Authors: Kuan-Ting Lu, Yuan-Chieh Chiu, Cheng-En Tsai, Hong-Ji Lee, Nan-Tzu Lian, Tahone Yang, Kuang-Chao Chen, Chih-Yuan Lu

Institution: Macronix International (Taiwan)

Language: English

Topic: Integrated Circuits and Semiconductor Failure Analysis

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410770944

FWCI:

Cites: 4

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Related to: 10