Work

Understanding the Mechanism of Metal Oxide Defect Formation at the Via Bottom

Year: 2025

Type: conference-paper

Source: Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

DOI: 10.1109/asmc64512.2025.11010432

Authors: Kannan Nivedhitha, Tung Sheng Wong, Leonardo Sutanto, Chin San Lee

Institution: GlobalFoundries (United States)

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410772019

FWCI:

Cites: 1

Cited by:

Related to: 10