Work

Board Level-Component Solder Joints Normalized Crack Severity Index of Solid-State Drive With Different Reliability Temperature Cycle Test Profiles

Year: 2025

Type: article

Source: IEEE Transactions on Device and Materials Reliability

DOI: 10.1109/tdmr.2025.3574447

Authors: Erwan Basiron, Adlil Aizat Ismail, Azman Jalar, Maria Abu Bakar, Azman Ahmad

Institution: National University of Malaysia

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4410808781

FWCI: 0.693

Cites: 17

Cited by: 3

Related to: 10