Work

Temperature-Insensitive Cryogenic Packaging for Thin-Film Lithium Niobate Photonic Chips

Year: 2025

Type: article

Abstract: As photonic integrated circuits (PICs) gain prominence in quantum communication and quantum computation, the development of efficient and stable cryogenic packaging technologies becomes paramount. This paper presents a robust and scalable cryogenic packaging method for thin-film lithium niobate (TFLN) photonic chips. The packaged fiber-to-chip interface shows a coupling efficiency of 15.7% ± 0.3%, with minimal variation of ±0.5% as the temperature cools down from 295 K to 1.5 K. Furthermore, the packaged chip exhibits outstanding stability over multiple thermal cycling, highlighting its potential for practical applications in cryogenic environments.

Source: Photonics

DOI: 10.3390/photonics12060545

Authors: Yongteng Wang, Yuxin Ma, Xiaojie Wang, Ziwei Zhao, Yongmin Li, Tianshu Yang

Institutions: Shanxi University, State Key Laboratory of Quantum Optics and Quantum Optics Devices

Language: English

Topic: Photorefractive and Nonlinear Optics

Subfield: Atomic and Molecular Physics, and Optics

Field: Physics and Astronomy

Domain: Physical Sciences

Open Access status: gold

Estimated APC paid: $2,896

Funder: National Natural Science Foundation of China