Work

Post-Breakdown IV Characteristics and Instabilities in Dense OTP Anti-Fuse Memories

Year: 2025

Type: article

Source: IEEE Transactions on Device and Materials Reliability

DOI: 10.1109/tdmr.2025.3574776

Authors: Mattia Rossetti, Laura Atzeni, Rita Zappa

Institution: STMicroelectronics (Italy)

Language: English

Topic: Semiconductor materials and devices

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410852605

FWCI: 0.231

Cites: 22

Cited by: 1

Related to: 10