Work

R2CTA: Reinforcement Learning and Reservoir Computing based Chiplets TSV Assignment

Year: 2025

Type: conference-paper

Source: International Symposium on Quality Electronic Design (ISQED)

DOI: 10.1109/isqed65160.2025.11014312

Authors: Xiaomeng Wang, Yang Yi

Institution: Virginia Tech

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410887451

FWCI:

Cites: 24

Cited by:

Related to: 10