Efficient Heat Dissipation Design of 3D Integrated Circuits Based on Heat Source Distribution Optimisation and Verification by Multi-Scenario Simulation
Year: 2025
Type: article
Abstract: Addressing the thermal degradation caused by the heat flow density of 3D integrated circuits exceeding 1000 W/cm², this paper proposes a synergistic design method combining heat source distribution optimization and dynamic weight adjustment. A 3D transient heat transfer-multiple physical field coupling model is established, and an innovative heat source dispersion index D is introduced to quantify layout uniformity. Additionally, a dynamic weighted genetic algorithm, T3D-FP, is developed to achieve the synergistic optimization of heat dissipation efficiency and layout compactness. Experiments show that, in the 50-95°C industrial scenario, the maximum temperature is reduced by 26.3% (107.1°C → 89.3°C) compared to the traditional method, temperature uniformity is improved by over 60%, and the thermal stress exceedance rate is reduced to 6.9%. The heat source dispersion D is significantly correlated with heat dissipation efficiency in FR4/ceramic substrates (R²>0.75). The peak temperature fluctuation under dynamic load is reduced to 62.3%, and the layout utilization remains stable at 85%-92%. These results provide a synergistic solution for thermal reliability and high integration in high-power consumption scenarios such as 5G base stations and AI chips, establishing a theoretical framework for complex multi-physical field coupled heat dissipation.
Author: Fanbo Wang
Institution: Tianjin University
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: hybrid
OpenAlex ID: W4410900367