Solution to Sidewall Roughness of High Aspect Ratio TSV Etch in Advanced Packaging
Year: 2025
Type: conference-paper
Authors: Yun Xiao, HeXin Zhou, QuanBao Li, XiaoHui Ren, CaiganChris Chen
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4410986545