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Study on Tungsten (W) Filling Void Improvement with Chamfered Gate Profiles

Year: 2025

Type: conference-paper

DOI: 10.1109/cstic64481.2025.11017980

Authors: Pengfei Lyu, Caigan Chen, Li Fei Sun

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410986795

FWCI:

Cites: 3

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Related to: 10