Work

Low-Frequency Noise Measurements for Electromigration Characterization of Cu Interconnect Under Metal Barrier Punch Through Process Optimization

Year: 2025

Type: conference-paper

DOI: 10.1109/cstic64481.2025.11018044

Authors: Chenxiao Xu, Xue Li, Luhao Zhou, Dawei Gao, Yunlong Li

Institution: Zhejiang University

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4410987112

FWCI:

Cites: 1

Cited by:

Related to: 10