Work

A Novel DNW Isolation Structure for Reducing Device Size

Year: 2025

Type: conference-paper

DOI: 10.1109/cstic64481.2025.11017792

Authors: Houping Yang, Minghui Zhu, Chenchen Qiu

Institution: Shanghai Huali Microelectronics (China)

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4410987155

FWCI:

Cites: 4

Cited by:

Related to: 10