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In-Device SEM-Based Overlay Metrology on VIA Layer of Logic Process

Year: 2025

Type: conference-paper

DOI: 10.1109/cstic64481.2025.11017840

Authors: Sheng Huang, Wei Zhu, Dennis Wang, Allen Wu, Chao Zhou, Qingpeng Zhu, Runzhi Wang, Jiawang Song, Wensheng Li, Or Zruya, Lee Rubinstein, Amir Rosen

Institutions: Hefei Institute of Technology Innovation, Applied Materials (Israel)

Language: English

Topic: Advancements in Photolithography Techniques

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410987166

FWCI:

Cites: 3

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Related to: 10