Work

Application and Improvement of CU CMP Thickness Control Method Based on R2R System

Year: 2025

Type: conference-paper

DOI: 10.1109/cstic64481.2025.11017944

Authors: Cheng Liu, Linlin Bi, Lei Zhang, Mingfei Yu, Jingxun Fang, Yu Zhang

Institutions: Shanghai University, Shanghai Huali Microelectronics (China)

Language: English

Topic: Advanced Surface Polishing Techniques

Subfield: Biomedical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410987173

FWCI:

Cites: 6

Cited by:

Related to: 10