Work

Etching Process Optimization of Deep Silicon Trench Sidewall Damage with High Aspect Ratio

Year: 2025

Type: conference-paper

DOI: 10.1109/cstic64481.2025.11017881

Authors: Yuxin Wang, Jia Ding, Ce Zhou, Shoulong Zhang, Zhengyuan Zhao, Li Tan, Min Yin, Zhicheng Zhang, Xuejing Wang, Wei Liu, Chi Zhou, Zhi Yao

Language: English

Topic: Plasma Diagnostics and Applications

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410987175

FWCI:

Cites: 8

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Related to: 10