Backside Chipping Improvement Study On Hybrid Bonding Process
Year: 2025
Type: conference-paper
Authors: Liang Tian, Zhi Jie Zhang, Rui Xiang Tang
Language: English
Topic: 3D IC and TSV technologies
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4410987235