Work

Impact of Carrier Lining Structure on the Wafer Edge Stress in Chemical Mechanical Double-Sided Polishing

Year: 2025

Type: conference-paper

DOI: 10.1109/cstic64481.2025.11017786

Authors: Yiran Liu, Jiayu Chen, Lei Zhu

Institutions: Fudan University, Shanghai Research Institute of Materials

Language: English

Topic: Advanced Surface Polishing Techniques

Subfield: Biomedical Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410987307

FWCI:

Cites: 4

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Related to: 10