Work

Comparison of simulation and actual test results and selection of molding material in Flip-Chip Package

Year: 2025

Type: conference-paper

DOI: 10.1109/cstic64481.2025.11017835

Authors: Chong Dong, Bin Yu, XiaoDong Tan, GuangYao Li, Yubo Wang, Siyu Yan

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4410987320

FWCI:

Cites: 4

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Related to: 10