Work

The Challenges and Solutions of Damascus Copper Process

Year: 2025

Type: conference-paper

DOI: 10.1109/cstic64481.2025.11017783

Authors: Yu Zhang, Zhaoqin Zeng

Institution: Shanghai Huali Microelectronics (China)

Language: English

Topic: Copper Interconnects and Reliability

Subfield: Electronic, Optical and Magnetic Materials

Field: Materials Science

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4410987356

FWCI: 5.113

Cites: 5

Cited by: 1

Related to: 10