SiC Etch with Inductively Coupled Plasma for Power Device Applications
Year: 2025
Type: conference-paper
Authors: Haiyang Lv, Shizheng Li, Yanzhi He
Institution: Advanced Micro-Fabrication Equipment (China)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4410987402
