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A Streamlined Electro-Thermal-Mechanical Simulation Method for Power Semiconductor Packaging Design

Year: 2025

Type: conference-paper

DOI: 10.1109/cstic64481.2025.11017895

Authors: Zixiao Huang, Daniel Wu, Robin Sun

Language: English

Topic: Silicon Carbide Semiconductor Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4410987541

FWCI:

Cites: 1

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Related to: 10