Work

Scaling EMIB—A Comprehensive Architecture Portfolio for Localized Interconnects

Year: 2025

Type: article

Source: IEEE Transactions on Electron Devices

DOI: 10.1109/ted.2025.3574287

Authors: Ravi Mahajan, Rahul Manepalli, Kemal Aygün, Kaladhar Radhakrishnan, Sujit Sharan

Institution: Intel (United States)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4411086606

FWCI: 2.309

Cites: 5

Cited by: 10

Related to: 10