Work

Validation of the solder paste imprinting process: KOKI S3X58-M650-7 based on an experiment conducted with the use of the DoE methodology

Year: 2025

Type: article

Abstract: This paper presents an analysis of the influence of selected parameters of the wire bonding process on the occurrence of lift-off defects using the Design of Experiments (DOE) methodology. A structured experimental plan was used to evaluate the effect of key process factors, including ultrasonic power, bonding time, and bond force. Statistical analysis was performed to identify significant variables and optimize the process parameters. The results indicate specific interactions between variables that contribute to the minimization of lift-off defects, thus enhancing bond quality and production yield.

Source: World Journal of Advanced Engineering Technology and Sciences

DOI: 10.30574/wjaets.2025.15.3.0759

Authors: Katarzyna Dymek, Piotr Hebel

Institution: Wrocław University of Science and Technology

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: hybrid

OpenAlex ID: W4411090851