Work

Ultra-Millisecond Flip-Chip Bonding Process via Intense Pulsed Light Irradiation

Year: 2025

Type: article

Source: ACS Applied Materials & Interfaces

DOI: 10.1021/acsami.5c07996

Authors: Young-Min Ju, Seong-Ung Ryu, Jong-Whi Park, Hak-Sung Kim

Institution: Hanyang University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: National Research Foundation of Korea, Ministry of Science and ICT, South Korea

Awards: G303752975, G6140965327

OpenAlex ID: W4411136331

FWCI: 2.04

Cites: 59

Cited by: 9

Related to: 10