On the Assumption Used for the Time-Dependent Warpage Analysis of Encapsulated Semiconductor Packages
Year: 2025
Type: article
Source: Journal of Electronic Packaging
DOI: 10.1115/1.4068884
Institution: University of Maryland, College Park
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
Award: G49982968
OpenAlex ID: W4411147201