Work

A Large Chip-Width TMICs Packaging Solution for THz Applications

Year: 2025

Type: article

Source: IEEE Microwave and Wireless Technology Letters

DOI: 10.1109/lmwt.2025.3575467

Authors: Ze Du, Zhi-Yu Duan, Ke Zhan, Zhen-Hua Wu, Ji-Sheng Chen, Hu Li, Ming-Zhou Zhan

Institution: University of Electronic Science and Technology of China

Language: English

Topic: Microwave Engineering and Waveguides

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: National Natural Science Foundation of China

Award: 太赫兹径向功率合成新理论及方法研究

OpenAlex ID: W4411203007

FWCI:

Cites: 25

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