Work

Wet Etching Process Optimization and Consistency Enhancement of Massive Through Glass Vias Through Laser-Induced Wet Etching

Year: 2025

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2025.3578609

Authors: Maoxiang Hou, Nan Liao, Junjie Zhang, Meihong He, Wei Feng, Yun Chen, Xin Chen

Institutions: Guangdong University of Technology, Guangzhou Mechanical Engineering Research Institute (China)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: National Natural Science Foundation of China, Basic and Applied Basic Research Foundation of Guangdong Province

Awards: G1752183852, G8089054809, G8442488629, G981922341

OpenAlex ID: W4411203274

FWCI: 1.813

Cites: 36

Cited by: 8

Related to: 10