Work

Transmission Channel and Matching Network Design Strategies in Chiplet-Based 2.5-D ICs for RF Applications

Year: 2025

Type: article

Source: IEEE Internet of Things Journal

DOI: 10.1109/jiot.2025.3578639

Authors: Changle Zhi, Gang Dong, Deguang Yang, Xin Luo, Junpeng Yao, Daihang Liu, Zhangming Zhu

Institution: Xidian University

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

Funders: National Natural Science Foundation of China, Postdoctoral Research Foundation of China, National Key Research and Development Program of China, Fundamental Research Funds for the Central Universities

Awards: G1981401797, G2320218852, G783504360, G8447460718, G8921095769

OpenAlex ID: W4411203402

FWCI: 0.231

Cites: 40

Cited by: 1

Related to: 10