Work

A New Methodology for Calculating the Statistical Distribution of Power Supply Noise in Chip-Package-PCB Co-Design

Year: 2025

Type: article

Source: IEEE Transactions on Instrumentation and Measurement

DOI: 10.1109/tim.2025.3578714

Authors: Yuhuan Luo, Xiuqin Chu, Haiyue Yuan, Tao Wei, Yuhao Huang, Jun Wang, Feng Wu, Yushan Li

Institution: Xidian University

Language: English

Topic: Electromagnetic Compatibility and Noise Suppression

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funders: National Natural Science Foundation of China, Key Research and Development Program of Ningxia, Fundamental Research Funds for the Central Universities, Key Research and Development Projects of Shaanxi Province

Awards: G1106345602, G1661710729, G2332027, G4614593100, G4626241765

OpenAlex ID: W4411203568

FWCI: 0.69

Cites: 27

Cited by: 3

Related to: 10