Work

Sample Preparation to Access Interposer Interconnects of Advanced Packaging for Probing

Year: 2025

Type: conference-paper

Source: IEEE Workshop on Microelectronics and Electron Devices (WMED)

DOI: 10.1109/wmed65750.2025.11026969

Authors: Liton Kumar Biswas, M Shafkat M Khan, Nitin Varshney, Patrick Craig, Yashan Peng, Jiaqi Tang, Navid Asadizanjani

Institution: University of Florida

Language: English

Topic: Physical Unclonable Functions (PUFs) and Hardware Security

Subfield: Hardware and Architecture

Field: Computer Science

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4411233016

FWCI: 0.899

Cites: 8

Cited by: 1

Related to: 10