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Monolithic 3D Macro Integrating CMOS with Ambipolar SONOS Tunnel FET for High Performance Edge-AI Computing Applications

Year: 2025

Type: conference-paper

Source: IEEE International Memory Workshop (IMW)

DOI: 10.1109/imw61990.2025.11026948

Authors: P. H. Tseng, F. M. Lee, C. C. Yang, H. W. Chiang, C. T. Huang, Y. H. Lin, Yu-Yu Lin, N. C. Lin, P. J. Sung, C. T. Wu, W. F. Wu, C. H. Shen, T. H. Hou, A. Y. Wu, H. Y. Cheng, T. H. Yeh, M. H. Lee, K. Y. Hsieh

Institutions: Macronix International (Taiwan), National Taiwan University, Research Center for Information Technology Innovation, Academia Sinica, Academia Sinica

Language: English

Topic: Advanced Memory and Neural Computing

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4411233358

FWCI:

Cites: 1

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