Hole-Side Airgap Integration as Enabler for 3D NAND Flash Z-Pitch Scaling
Year: 2025
Type: conference-paper
Authors: S. Rachidi, S. Ramesh, D. Verreck, J. Loyo, Y. Jeong, H. Puliyalil, J. Li, F. Seidel, G. Van Den Bosch, M. Rosmeulen
Institution: IMEC
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4411233383