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Packaging 4.0: Artificial Intelligence and Machine Learning Applications in the Food Packaging Industry

Year: 2025

Type: article

Source: Current Food Science and Technology Reports

DOI: 10.1007/s43555-025-00064-w

Authors: Lokesh Kumar, Richa Dutt, Kirtiraj K. Gaikwad

Institutions: Indian Institute of Technology Roorkee, University of Florida

Language: English

Topic: Impact of AI and Big Data on Business and Society

Subfield: Management Science and Operations Research

Field: Decision Sciences

Domain: Social Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4411286690

FWCI: 22.96

Cites: 24

Cited by: 30

Related to: 10